Flexible circuit board and chip package including same
US11239172B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 25, 2018 |
| Grant date | Feb 1, 2022 |
| Priority date | — |
| Expiry date | Nov 2, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09781
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A flexible circuit board according to an embodiment of the present invention comprises: a substrate; a first wiring pattern layer disposed on a first surface of the substrate; a second wiring pattern layer disposed on a second surface opposite the first surface of the substrate; a first dummy pattern part disposed on the second surface of the substrate on which the second wiring pattern layer is not disposed; a first protection layer disposed on the first wiring pattern layer; and a second protection layer disposed on the second wiring pattern layer and the first dummy pattern part, wherein at least a part of the first dummy pattern part overlaps with the first wiring pattern layer in a vertical direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.