Semiconductor device
US11239231B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 4, 2020 |
| Grant date | Feb 1, 2022 |
| Priority date | — |
| Expiry date | Sep 4, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/62
Abstract
A semiconductor device includes a semiconductor part; first and second electrodes respectively on back and front surfaces of the semiconductor part; a control electrode provided inside a trench of the semiconductor part; a third electrode provided inside the trench; a diode element provided at the front surface of the semiconductor part; a resistance element provided on the front surface of the semiconductor part via an insulating film, the diode element being electrically connected to the second electrode; a first interconnect electrically connecting the diode element and the resistance element, the first interconnect being electrically connected to the third electrode; and a second interconnect electrically connecting the resistance element and the semiconductor part. The resistance element is connected in series to the diode element. The diode element is provided to have a rectifying property reverse to a current direction flowing from the resistance element to the second electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.