CMOS color image sensors with metamaterial color splitting
US11239276B2 · kind B2 · utility
2Cited by
5References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 18, 2019 |
| Grant date | Feb 1, 2022 |
| Priority date | — |
| Expiry date | Jul 29, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/806
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Methods to build multi-functional scattering structures while respecting tight requirements imposed by manufacturing processes are described. The described methods and devices are based on etching away wire networks embedded in 3D structures to form voids in order to perform a target function. Optimization algorithms for designing binarized devices that meet manufacturing requirements are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.