Optoelectronic semiconductor component and biometric sensor
US11239398B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 26, 2018 |
| Grant date | Feb 1, 2022 |
| Priority date | — |
| Expiry date | Jul 26, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06V40/19
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An optoelectronic semiconductor component may include at least one optoelectronic semiconductor chip, a reflector, a lens, and a connecting layer. The reflector may have a reflector recess where the semiconductor chip may be arranged. The lens may be fully located in the reflector recess, and the lens may have a lens recess. The connecting layer may fasten the lens on the reflector. The lens may have a lens outer side facing toward a reflector inner wall of the reflector recess. A gap may be between the reflector and the lens, and the gap may be filled only partially with the connecting layer. The semiconductor chip may not touch the lens. The optoelectronic semiconductor component may be incorporated into a biometric sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.