3D printed active electronic materials and devices
US11239422B2 · kind B2 · utility
7Cited by
0References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 5, 2018 |
| Grant date | Feb 1, 2022 |
| Priority date | — |
| Expiry date | Jul 8, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Disclosed is a process whereby diverse classes of materials can be 3D printed and fully integrated into device components with active properties. An exemplary embodiment shows the seamless interweaving of five different materials, including (1) emissive semiconducting inorganic nanoparticles, (2) an elastomeric matrix, (3) organic polymers as charge transport layers, (4) solid and liquid metal leads, and (5) a UV-adhesive transparent substrate layer, demonstrating the integrated functionality of these materials. Further disclosed is a device for printing these fully integrated 3D devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.