Patent · US Active

Method for producing a printed circuit board-cooling body structure

US11240905B2 · kind B2 · utility

0Cited by
6References
7Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 8, 2020
Grant dateFeb 1, 2022
Priority date
Expiry dateJun 8, 2040

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K2201/2072
  • WIPO fieldAudio-visual technology
  • WIPO sectorElectrical engineering

Abstract

The invention relates to a method for producing a printed circuit board—cooling body structure and such a printed circuit board—cooling body structure, in particular for arrangement in a lighting device of a vehicle, the method comprising at least the following steps: providing a base plate; coating a carrier side of the base plate with an insulation layer and/or with a solder resist; fitting the carrier side with at least one electronic component and applying cooling rib bodies to a cooling side of the base plate opposite the carrier side.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.