Method for producing a printed circuit board-cooling body structure
US11240905B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 8, 2020 |
| Grant date | Feb 1, 2022 |
| Priority date | — |
| Expiry date | Jun 8, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2072
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention relates to a method for producing a printed circuit board—cooling body structure and such a printed circuit board—cooling body structure, in particular for arrangement in a lighting device of a vehicle, the method comprising at least the following steps: providing a base plate; coating a carrier side of the base plate with an insulation layer and/or with a solder resist; fitting the carrier side with at least one electronic component and applying cooling rib bodies to a cooling side of the base plate opposite the carrier side.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.