Circuit board heat dissipation system
US11240906B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 3, 2020 |
| Grant date | Feb 1, 2022 |
| Priority date | — |
| Expiry date | Dec 3, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10409
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board heat dissipation system includes circuit board unit that includes a motherboard and a daughterboard, a base seat, and a fastening unit that includes a plurality of first and second fastening components. Each first fastening component extends through the daughterboard and is engaged with the base seat. Each second fastening component includes a long fastener that extends through the base seat and the daughterboard and that is engaged with the motherboard, and a flat washer and a resilient member that are sleeved on the long fastener. The resilient member is disposed between a head portion of the long fastener and the flat washer for biasing the base seat and the daughterboard against the motherboard.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.