Flexible substrate and method for manufacturing same, and flexible electronic device
US11240911B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 21, 2019 |
| Grant date | Feb 1, 2022 |
| Priority date | — |
| Expiry date | Apr 17, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/3737
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed are a flexible substrate and a method for manufacturing the same, and a flexible electronic device. The flexible substrate includes: a flexible base; a plurality of electronic components disposed on the flexible base, a first gap being formed between each two adjacent electronic components of the plurality of electronic components; and a plurality of metal lines, wherein at least one end of each of the metal lines is connected to the corresponding electronic component, at least a portion of the plurality of metal lines are disposed in the first gap, and a length of each metal line disposed in the first gap is greater than a width of the first gap in an extension direction of the metal line; wherein a first filling layer is disposed in the first gap to wrap the metal line disposed in the first gap.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.