Method for flip-chip bonding using anisotropic adhesive polymer
US11240918B2 · kind B2 · utility
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9Claims
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Key dates
| Filing date | Aug 28, 2019 |
| Grant date | Feb 1, 2022 |
| Priority date | — |
| Expiry date | Aug 28, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0425
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention discloses flip-chip bonding method using an anisotropic adhesive polymer. The method includes applying an adhesive polymer solution containing metal particles dispersed therein onto a circuit substrate to form an adhesive polymer layer such that the adhesive polymer layer covers the metal particles; drying the adhesive polymer layer; and positioning an electronic element to be electrically connected to the circuit substrate on the dried adhesive polymer layer and causing dewetting of the polymer from the metal particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.