Wall system with electronic device mounting assembly
US11240922B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 8, 2017 |
| Grant date | Feb 1, 2022 |
| Priority date | — |
| Expiry date | Jun 8, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K5/0204
- WIPO fieldMechanical elements
- WIPO sectorMechanical engineering
Abstract
A wall module includes a frame and a tile connected thereto. The tile includes an opening in which an electronic device mounting assembly is mounted. The electronic device mounting assembly includes a mounting plate having a receiving area configured to have an electronic device mounted therein. The electronic device mounting assembly also includes securing elements configured to selectively secure the electronic device within the receiving area and a face plate configured to cover an edge of the opening in the tile as well as a peripheral edge of the electronic device. The wall module having the electronic device mounting assembly described above can be a single wall module within a modular wall having a plurality of wall modules, each of the plurality of wall modules being with or without an electronic device mounting assembly mounted therein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.