Thermal bridge for an electrical component
US11240934B1 · kind B1 · utility
3Cited by
25References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 22, 2020 |
| Grant date | Feb 1, 2022 |
| Priority date | — |
| Expiry date | Jul 22, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thermal bridge includes upper and lower bridge assemblies including upper and lower plates arranged in stacks. Sides of the plates face each other to thermally interface the lower plates with the upper plates. The thermal bridge includes a spring element positioned between the upper bridge assembly and the lower bridge assembly. The thermal bridge includes an internal bridge frame having connecting elements that extend internally through the upper plates and the lower plates to hold the upper plates in the upper plate stack and to hold the lower plates in the lower plate stack.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.