Cooking vessel with a thermal sensor
US11241113B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 9, 2019 |
| Grant date | Feb 8, 2022 |
| Priority date | — |
| Expiry date | Dec 9, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B2213/06
- WIPO fieldFurniture, games
- WIPO sectorOther fields
Abstract
According to one example, a cookware apparatus includes a vessel. The vessel includes a bottom, and a sidewall surrounding the bottom and extending upward from the bottom so as to form a fluid retaining interior region. The sidewall terminates at a rim. The vessel also includes a channel extending through a portion of the bottom and further extending upward into and through a portion of the sidewall. The channel has an opening positioned in an external surface of the sidewall. The cookware apparatus further includes a thermal sensor positioned within the channel. The thermal sensor extends through the portion of the bottom and further extends upward into and through the portion of the sidewall.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.