Induction-based heat retentive server
US11241117B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2017 |
| Grant date | Feb 8, 2022 |
| Priority date | — |
| Expiry date | Mar 21, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B6/105
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A heat retentive server includes a chamber defined between an upper shell and a lower shell that are connected to one another. An induction-heatable member is positioned in the chamber, and the induction-heatable member may be heated by electromagnetic induction to a first temperature that is greater than the heat deflection temperature of the upper shell. Buffering material comprising an inhibitively conductive hydrophobic material is positioned in the chamber between the induction-heatable member and the upper shell, and the buffering material is adapted for providing predetermined conductive heat transfer from the induction-heatable member to the upper shell so that at least a portion of the upper shell is heated to a second temperature that is greater than the heat deflection temperature of the upper shell. The second temperature is less than the first temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.