Resin powder, device for solid freeform fabrication object, and method of manufacturing solid freeform fabrication object
US11241825B2 · kind B2 · utility
0Cited by
2References
16Claims
0Family size
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Key dates
| Filing date | Aug 29, 2019 |
| Grant date | Feb 8, 2022 |
| Priority date | — |
| Expiry date | Nov 26, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G69/26
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A resin powder contains a resin, wherein the proportion of fine powder having a number diameter of 40 percent or less of a mean number diameter Mn of the resin powder is 30 percent or less in the resin powder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.