Method of manufacturing light-emitting device
US11242961B2 · kind B2 · utility
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1References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 26, 2021 |
| Grant date | Feb 8, 2022 |
| Priority date | — |
| Expiry date | Apr 26, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/855
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a light-emitting device includes: placing a light-emitting element; providing a light-shielding frame; supplying a light-reflective resin; providing a light-transmissive member; forming an optical member; and bonding an upper surface of the light-emitting element and a surface of the light-transmissive member with each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.