Wafer bonded piezoresistive and piezoelectric force sensor and related methods of manufacture
US11243126B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 27, 2018 |
| Grant date | Feb 8, 2022 |
| Priority date | — |
| Expiry date | Sep 26, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N69/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Described herein is a ruggedized microelectromechanical (“MEMS”) force sensor. The sensor employs piezoresistive or piezoelectric sensing elements for force sensing where the force is converted to strain and converted to electrical signal. In one aspect, both the piezoresistive and the piezoelectric sensing elements are formed on one substrate and later bonded to another substrate on which the integrated circuitry is formed. In another aspect, the piezoelectric sensing element is formed on one substrate and later bonded to another substrate on which both the piezoresistive sensing element and the integrated circuitry are formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.