Systems for integrated decomposition and scanning of a semiconducting wafer
US11244841B2 · kind B2 · utility
5Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 26, 2018 |
| Grant date | Feb 8, 2022 |
| Priority date | — |
| Expiry date | Nov 24, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/12
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.