Method of producing microelectronic components with a layer structure

US11245052B2 · kind B2 · utility

Assignee

• 3D-Micromac AG · DE

Inventors

• Sven Albert · Kohren-Sahlis, DE
• Rene Boettcher · Lauenhain, DE
• Alexander Boehm · Dresden, DE
• Mike Lindner · Chemnitz, DE
• Thomas Schmidt · Thierhaupten, DE

Key dates

• Filing date: Mar 21, 2018
• Grant date: Feb 8, 2022
• Expiry date: Mar 21, 2038

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B32B2457/14
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method of producing microelectronic components includes forming a functional layer system; applying a laminar carrier to the functional layer system; attaching a workpiece to a workpiece carrier; utilizing incident radiation of a laser beam is focused in a boundary region between a growth substrate and the functional layer system, and a bond between the growth substrate and the functional layer system in the boundary region is weakened or destroyed; separating a functional layer stack from the growth substrate, wherein a vacuum gripper having a sealing zone that circumferentially encloses an inner region is applied to the reverse side of the growth substrate, a negative pressure is generated in the inner region such that separation of the functional layer stack from the growth substrate is initiated in the inner region; and the growth substrate held on the vacuum gripper is removed from the functional layer stack.