Electric component with sensitive component structures and method for producing an electric component with sensitive component structures
US11245977B2 · kind B2 · utility
0Cited by
0References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 19, 2015 |
| Grant date | Feb 8, 2022 |
| Priority date | — |
| Expiry date | Oct 23, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/058
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention relates to a simple to produce electric component for chips with sensitive component structures. Said component comprises a connection structure and a switching structure on the underside of the chip and a support substrate with at least one polymer layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.