Patent · US Active

Power electronics assembly

US11246244B2 · kind B2 · utility

4Cited by

6References

20Claims

0Family size

Assignee

ZF FRIEDRICHSHAFEN AG · DE

Inventors

Marco Denk · Memmelsdorf, DE
Johannes Hager · Marktleugast, DE
Michael Sperber · Bayreuth, DE

Key dates

Filing date	Feb 5, 2019
Grant date	Feb 8, 2022
Priority date	—
Expiry date	Feb 5, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH05K7/209
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A power electronics assembly comprises a heat sink, at least two half bridge modules mounted on one side of the heat sink, a circuit board mounted on the half bridge modules, and at least one capacitor mounted on the circuit boards, wherein each of the half bridge modules has a housing that has a cold side that is mounted on the heat sink, and the housing has a connection side from which numerous connection pins project for each DC connection in the half bridge module that are connected to the circuit board, and wherein conductors in the circuit board are designed to connect the half bridge modules in parallel and connect them to the at least one capacitor to form a DC link.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.