Micro-component transfer systems, methods, and devices
US11246251B2 · kind B2 · utility
0Cited by
12References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 2, 2019 |
| Grant date | Feb 8, 2022 |
| Priority date | — |
| Expiry date | Sep 12, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67144
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A system includes a computing device with circuitry and memory with instructions for execution by the circuitry. The instructions include monitoring signals indicative of a non-uniform distance between a transfer head and a receiving substrate, and, in response to the monitored signals, actuating one or more actuators towards the transfer head or the receiving substrate to deform the transfer head or the receiving substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.