Patent · US Active

Implantable electrical contact arrangement

US11247042B2 · kind B2 · utility

0Cited by

6References

12Claims

0Family size

Assignee

NEUROLOOP GMBH · DE

Inventors

Tim BORETIUS · Freiburg (Elbe), DE
Fabian KIMMIG · Freiburg (Elbe), DE
Christina Hassler · Reute, DE
Dennis Plachta · Denzlingen, DE

Key dates

Filing date	Nov 17, 2017
Grant date	Feb 15, 2022
Priority date	—
Expiry date	Jun 14, 2038

Classification

Technology area (CPC A)Human Necessities
CPC primaryA61N1/3752
WIPO fieldMedical technology
WIPO sectorInstruments

Abstract

An implantable electrical contact arrangement is described which has at least one electrode body arrangement composed otherwise entirely of biocompatible, electrically insulating material, with at least one freely accessible electrode surface enclosed directly or indirectly by the biocompatible electrically insulating material. The invention is characterized in that the electrode body arrangement has a stack-shaped layer composite which provides at least one gold layer connected to an iridium layer via a diffusion barrier layer. The stack-shaped layer composite by being completely encapsulated by an SiC layer, with the exception of at least one surface region of the iridium layer facing to be directed away from the layer composite. The SiC layer has an SiC layer surface which is facing to be directed away from the stack-shaped layer composite and which is adjoined directly or indirectly by the biocompatible, electrically insulating material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.