Implantable medical devices with flexible interconnect having strain relief
US11247060B2 · kind B2 · utility
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10Claims
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Key dates
| Filing date | Feb 25, 2019 |
| Grant date | Feb 15, 2022 |
| Priority date | — |
| Expiry date | Aug 20, 2039 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61N1/3956
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
Implantable medical devices including interconnections having strain-relief structure. The interconnections can take the form of flexible circuits. Strain relief gaps and shapes are integrated in the interconnections to relieve forces in each of three dimensions. In some examples, the region of an interconnection which couples with a component of the implantable medical device is separated by a strain relief gap from a connection to a second component and/or a location where the flex bends around a corner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.