Method for coating a substrate with a lacquer and device for planarising a lacquer layer
US11247229B2 · kind B2 · utility
0Cited by
3References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 24, 2019 |
| Grant date | Feb 15, 2022 |
| Priority date | — |
| Expiry date | Apr 13, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/168
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The disclosure relates to a method for coating a substrate with a lacquer. First, the lacquer is uniformly applied to the substrate. Then, the solvent proportion of the lacquer applied to the substrate is reduced, and the coated substrate is exposed to a solvent atmosphere. In some embodiments, the lacquer is heated. The invention also relates to a device for planarising a lacquer layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.