Liquid-assisted laser micromachining systems and methods for processing transparent dielectrics and optical fiber components using same
US11247932B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 25, 2019 |
| Grant date | Feb 15, 2022 |
| Priority date | — |
| Expiry date | Dec 21, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/3688
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The liquid-assisted micromachining methods include methods of processing a substrate made of a transparent dielectric material. A working surface of the substrate is placed in contact with a liquid-assist medium that comprises fluorine. A focused pulsed laser beam is directed through a first substrate surface and through the opposite working surface to form a focus spot in the liquid-assist medium. The focus spot is then moved over a motion path from its initial position in the liquid-assist medium through the substrate body in the general direction from the working surface to the first surface to create a modification of the transparent dielectric material that defines in the body a core portion. The core portion is removed to form the substrate feature, which can be a through or closed fiber hole that supports one or more optical fibers. Optical components formed using the processed substrate are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.