Epoxy resin material, preparation method therefor and application thereof
US11248085B2 · kind B2 · utility
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19Claims
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Key dates
| Filing date | Sep 28, 2017 |
| Grant date | Feb 15, 2022 |
| Priority date | — |
| Expiry date | Sep 28, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L63/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides an epoxy resin material, a preparation method therefor and an application thereof. The present method for preparing an epoxy resin material comprises: heating a mixture of an epoxy resin main agent and a curing agent that are placed at room temperature to 40-85° C. for reaction and curing. The curing agent contains an adduct of an olefinic nitrile compound and an amine compound. The present method for preparing an epoxy resin material has the characteristics of low mixing viscosity, long operation time, and low amount of heat released during preparation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.