Copper electrolytic plating bath and copper electrolytic plating film
US11248305B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 18, 2018 |
| Grant date | Feb 15, 2022 |
| Priority date | — |
| Expiry date | Feb 18, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D7/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention provides a technology for, in copper electrolytic plating containing silver ions as an alloy component, obtaining a copper electrolytic plating film in which co-deposition of sulfur can be significantly suppressed and which is excellent in physical properties such as strength and hardness even after a high-temperature heat treatment at about 200° C. or higher. The present invention is a copper electrolytic plating bath comprising copper ions, an acid, chloride ions, and a complexing agent, wherein the copper electrolytic plating bath further comprises silver ions as an alloy component, and wherein methionine or a derivative thereof is contained as the complexing agent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.