Thermal optimizations for OSFP optical transceiver modules
US11249264B2 · kind B2 · utility
5Cited by
22References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 15, 2020 |
| Grant date | Feb 15, 2022 |
| Priority date | — |
| Expiry date | Dec 15, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4284
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.