Photolithography method, method of preparing flexible substrate and photoresist drying device
US11249399B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | May 8, 2019 |
| Grant date | Feb 15, 2022 |
| Priority date | — |
| Expiry date | Feb 21, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/2004
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photolithography method, a method of preparing a flexible substrate and a photoresist drying device are provided. The photolithography method includes: providing a base substrate on which a material layer to be etched is formed, in which the base substrate includes an intermediate region and a peripheral region surrounding the intermediate region; coating a layer of photoresist on the base substrate, in which the photoresist is coated in the intermediate region and the peripheral region, and is formed to cover the material layer to be etched; and drying the photoresist and simultaneously performing a first exposure process on the photoresist coated in the peripheral region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.