Three-dimensional (3D) printing of a tamper sensor assembly
US11250171B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 21, 2020 |
| Grant date | Feb 15, 2022 |
| Priority date | — |
| Expiry date | Jan 21, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F21/88
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A tamper sensor assembly includes a lid having a surface and a sensor substrate on the surface of the lid. The sensor substrate has conductive lines that extend across at least a major portion of the surface of the lid and conform to three dimensional characteristics of the surface of the lid. The security processor is electrically connected to the conductive lines of the sensor substrate and is configured to identify occurrence of tampering with the lid based on an electrical characteristic of signals conducted through the conductive lines, and to perform an anti-tampering operation responsive to identifying occurrence of tampering.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.