Semiconductor device
US11251101B2 · kind B2 · utility
0Cited by
5References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 25, 2020 |
| Grant date | Feb 15, 2022 |
| Priority date | — |
| Expiry date | Feb 25, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/0061
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A main ceramic circuit board on which a semiconductor element is arranged is separate from a sub-ceramic circuit board on which a connection terminal is arranged. Accordingly, heat generated by the semiconductor element is conducted via the main ceramic circuit board and a base plate arranged thereunder and the sub-ceramic circuit board to the connection terminal. That is to say, it is difficult to conduct heat from the semiconductor element to the connection terminal, compared with a case where the connection terminal and the semiconductor element are arranged over the same ceramic circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.