Electronic device module and method of manufacturing the same
US11251135B2 · kind B2 · utility
0Cited by
5References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 6, 2018 |
| Grant date | Feb 15, 2022 |
| Priority date | — |
| Expiry date | Jul 15, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device module includes a substrate, at least one first component and at least one second component disposed on one surface of the substrate, a second sealing portion having the at least one second component embedded therein, and disposed on the substrate, and a first sealing portion disposed outside of the second sealing portion, at least a portion of the first sealing portion being disposed between the at least one first component and the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.