Removable interposer
US11251171B2 · kind B2 · utility
2Cited by
20References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 13, 2018 |
| Grant date | Feb 15, 2022 |
| Priority date | — |
| Expiry date | Jun 18, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3512
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments may relate to a substrate for use in a system in package (SIP). The substrate may include a first couple to couple with a first component via a permanent couple such that the first component is communicatively coupled with a bridge. The substrate may further include a second couple to removably couple with an interposer such that the interposer is communicatively coupled with the bridge via a communicative couple. Other embodiments may be described or claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.