Routing for three-dimensional integrated structures
US11251175B2 · kind B2 · utility
2Cited by
3References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 6, 2019 |
| Grant date | Feb 15, 2022 |
| Priority date | — |
| Expiry date | Jan 22, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/83
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A three-dimensional integrated structure is formed by a first substrate with first components oriented in a first direction and a second substrate with second components oriented in a second direction. An interconnection level includes electrically conducting tracks that run in a third direction. One of the second direction and third direction forms a non-right and non-zero angle with the first direction. An electrical link formed by at least one of the electrically conducting tracks electrically connected two points of the first or of the second components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.