Responding to a failure of a main die of a switch data-plane device
US11251245B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 21, 2020 |
| Grant date | Feb 15, 2022 |
| Priority date | — |
| Expiry date | Jan 21, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04L47/2433
- WIPO fieldDigital communication
- WIPO sectorElectrical engineering
Abstract
A method for responding to a failure of a main die of a switch data-plane device, the method may include applying a secondary packet forwarding process by multiple chiplets, following the failure of the main die and during at least a part of an execution of a synchronous graceful process that follows the failure of the main die; wherein the multiple chiplets are interconnected to each other by a secondary interconnect; wherein the multiple chiplets and are coupled to the main die by a primary interconnect; wherein the applying of the secondary packet forwarding process is less complex than a primary forwarding process applied by the main die while the main die is functional.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.