Patent · US Active

Method of fabrication of a photonic chip comprising an SACM-APD photodiode optically coupled to an integrated waveguide

US11251326B2 · kind B2 · utility

2Cited by

1References

13Claims

0Family size

Assignee

COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES · FR

Inventors

Bertrand Szelag · Grenoble, FR
Laetitia Adelmini · Grenoble, FR
Stephane Brision · Grenoble, FR

Key dates

Filing date	Mar 27, 2020
Grant date	Feb 15, 2022
Priority date	—
Expiry date	Apr 16, 2040

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P70/50
WIPO fieldOptics
WIPO sectorInstruments

Abstract

The invention relates to a method of fabrication of a photonic chip 1 comprising an avalanche photodiode 20 of the SACM type optically coupled to an integrated waveguide 40, comprising a step for forming a first spacer 24 allowing a constant peripheral recessing drzc of the charge region 23 to be defined later on with respect to an edge of the multiplication portion 22, then a step for forming a second spacer 26 allowing a constant peripheral recessing drpa of the absorption portion 27 to be defined later on with respect to an edge of the charge region 23.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.