Thin-film encapsulation structures, manufacturing methods, and display apparatus therewith
US11251402B2 · kind B2 · utility
0Cited by
3References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 28, 2018 |
| Grant date | Feb 15, 2022 |
| Priority date | — |
| Expiry date | Aug 26, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K2101/80
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thin-film encapsulation structure includes a number of inorganic film layers and at least one organic film layer laminated alternately at one side of an organic light-emitting diode. The number of inorganic film layers include N inorganic film layers including first to N-th inorganic film layers arranged sequentially from inside to outside, N≥2. At least the first inorganic film layer has a refractive index increasing gradually from inside to outside.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.