Organic light emitting diode display panel with barrier film package bag and fabricating method thereof
US11251405B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 3, 2019 |
| Grant date | Feb 15, 2022 |
| Priority date | — |
| Expiry date | Feb 24, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
Abstract
The present invention provides an organic light emitting diode display panel and a fabricating method thereof. The organic light emitting diode display panel includes a lower substrate, having one side extending to form a signal path; an upper cover plate on the lower substrate, wherein a lower surface of the upper cover plate is connected to an upper surface of the lower substrate; and a barrier film package bag enclosing the upper cover plate and the lower substrate from a side away from the signal channel. The method of fabricating the OLED display panel includes following steps: forming a lower substrate; forming an upper cover plate; bonding the upper cover plate to the lower substrate; and packaging the display panel to be packaged by vacuum thermocompression. The present invention simplifies the packaging of the OLED display panel and can meet the package requirements of various types of OLED display panels.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.