Acoustic resonator package and method of fabricating the same
US11251772B2 · kind B2 · utility
0Cited by
4References
12Claims
0Family size
Assignee
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Key dates
| Filing date | Nov 1, 2018 |
| Grant date | Feb 15, 2022 |
| Priority date | — |
| Expiry date | Aug 16, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H2003/023
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
An acoustic resonator package includes a substrate, an acoustic resonator disposed on the substrate, the acoustic resonator including a first hydrophobic layer, a cap configured to accommodate the acoustic resonator, a bonding portion configured to bond the substrate to the cap, and a second hydrophobic layer disposed on the substrate at a position between the acoustic resonator and the bonding portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.