Radio frequency module
US11251829B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 16, 2020 |
| Grant date | Feb 15, 2022 |
| Priority date | — |
| Expiry date | Oct 14, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10166
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A radio frequency module is provided. A matching circuit includes an inductor which is connected in series to the power amplifier and is formed in a substrate. The substrate includes a ground layer, a low permittivity portion, and a high permittivity portion. The ground layer at least partially overlaps with a first input terminal of the low-noise amplifier in a plan view from a thickness direction of the substrate. The low permittivity portion at least partially overlaps with the first input terminal in a plan view from the thickness direction, and is provided between the first input terminal and the ground layer. The high permittivity portion is in contact with the inductor and has the permittivity greater than the permittivity of the low permittivity portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.