Package structure and methods of manufacturing sound producing chip, forming package structure and forming sound producing apparatus
US11252511B2 · kind B2 · utility
0Cited by
9References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 31, 2021 |
| Grant date | Feb 15, 2022 |
| Priority date | — |
| Expiry date | May 31, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2201/003
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A package structure includes a housing and a sound producing chip. The sound producing chip is disposed within the housing. The sound producing chip includes a membrane and an actuator. The membrane includes a coupling plate and a spring structure connected to the coupling plate. The actuator is configured to receive a driving signal to actuate the membrane. The spring structure is situated between the coupling plate and the actuator. The coupling plate is actuated to move by the actuator via the spring structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.