Chip or silicon based feedthrough
US11253710B2 · kind B2 · utility
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18Claims
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Assignee
Inventors
Key dates
| Filing date | Jan 5, 2018 |
| Grant date | Feb 22, 2022 |
| Priority date | — |
| Expiry date | Jul 6, 2039 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61N1/3956
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
This document discusses, among other things, systems and methods to fabricate and operate an implantable medical device. The implantable medical device can include a housing portion defining an interior chamber. The implantable medical device can include a circuit in the interior chamber. The implantable medical device can include a first electronic component that is not in the interior chamber. The implantable medical device can include a substrate coupled to the housing, the substrate including a first via extending through the substrate, the first via electrically coupling the first electronic component to the circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.