Material processing systems
US11253917B2 · kind B2 · utility
0Cited by
2References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 21, 2018 |
| Grant date | Feb 22, 2022 |
| Priority date | — |
| Expiry date | Dec 31, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2922
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Material processing systems are disclosed. Some systems include methods of eliminating or reducing defects in elongate workpieces that can undergo large deformations during processing. Some systems include apparatus configured to facilitate such large deformations while maintaining internal stresses (e.g., tensile stresses) below a threshold stress. Some disclosed systems pertain to powder extrusion techniques. Continuous and batch processing systems are disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.