Light emitting device and method for manufacturing the same
US11254077B2 · kind B2 · utility
0Cited by
1References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 12, 2019 |
| Grant date | Feb 22, 2022 |
| Priority date | — |
| Expiry date | Jun 13, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0362
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for manufacturing a light emitting device includes: preparing a baseplate having a plate surface on which a protrusion is disposed; forming a first resin frame having an opening on the plate surface, wherein the opening is located above the protrusion; forming a second resin in the opening; detaching the baseplate; bonding a light emitting element to a surface of the second resin surface that has been exposed as a result of detaching the baseplate; and forming a third resin that surrounds lateral faces of the light emitting element and that covers and contacts a portion of the first resin frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.