Preparation method of bionic adhesive material with tip-expanded microstructural array

US11254566B2 · kind B2 · utility

Assignees

• Nanjing University of Aeronautics and Astronautics · CN
• NANJING LI-HANG INDUSTRY INSTITUTE OF BIONIC TECHNOLOGY LIMITED COMPANY · CN

Inventors

• Zhendong Dai · Ningbo City, CN
• Keju Ji · Nanjing, CN
• Enhua Cui · Nanjing, CN
• Jian-Hong Chen · Taoyuan, TW
• Cong Yuan · Nanhu, CN
• Yiqiang Tang · Nanjing, CN

Key dates

• Filing date: Jun 11, 2020
• Grant date: Feb 22, 2022
• Expiry date: Jun 11, 2040

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02E60/10
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

A preparation method of a bionic adhesive material with a tip-expanded microstructural array includes the following steps: machining through-holes on a metal sheet; modifying morphology of a through-hole by electroplating, using the metal sheet in step 1 as an electroplating cathode, and arranging the electroplating cathode and an electroplating anode in parallel to prepare a hyperboloid-like through-hole array assembly, fitting a lower surface of the hyperboloid-like through-hole array assembly tightly to an upper surface of a substrate assembly to prepare a through-hole assembly of a mold; and filling the mold assembly with a polymer, curing, and demolding to obtain the adhesive material with the tip-expanded microstructural array.