Dipping bath compositions for treating reinforcing inserts
US11254794B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 18, 2019 |
| Grant date | Feb 22, 2022 |
| Priority date | — |
| Expiry date | Jan 11, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2301/312
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
The present invention relates to an aqueous, solids-containing dipping bath composition for treating reinforcing inserts for rubber products comprising the following components or consisting of these components, (A) at least one blocked MDI mixture, the MDI mixture comprising MDI oligomers of formula (I), n being a whole number from 1 to 8, and MDI monomers; (B) at least one latex; (C) at least one compound selected from the group consisting of polyacrylates, lignin derivatives and mixtures hereof; and (D) possibly at least one additive; the dipping bath composition being essentially free of epoxides, and the dipping bath composition being essentially free of resorcinol, formaldehyde and the reaction products thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.