Integrated digital force sensors and related methods of manufacture

US11255737B2 · kind B2 · utility

Assignee

• NextInput, Inc. · US

Inventors

• Ali Foughi · Atherton, US
• Ryan Diestelhorst · Atlanta, US
• Dan Benjamin · Buffalo, US
• Julius Minglin Tsai · San Jose, US
• Michael Dueweke · Santa Clara, US

Key dates

• Filing date: Feb 9, 2018
• Grant date: Feb 22, 2022
• Expiry date: Feb 9, 2038

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81C2203/0728
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

In one embodiment, a ruggedized wafer level microelectromechanical (“MEMS”) force sensor includes a base and a cap. The MEMS force sensor includes a flexible membrane and a sensing element. The sensing element is electrically connected to integrated complementary metal-oxide-semiconductor (“CMOS”) circuitry provided on the same substrate as the sensing element. The CMOS circuitry can be configured to amplify, digitize, calibrate, store, and/or communicate force values through electrical terminals to external circuitry.