Photonics packaging method and device
US11256029B2 · kind B2 · utility
7Cited by
31References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 15, 2019 |
| Grant date | Feb 22, 2022 |
| Priority date | — |
| Expiry date | Oct 15, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2006/12142
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Photonic packages are described. One such photonic package includes a photonic chip, an application specific integrated circuit, and optionally, an interposer. The photonic chip includes photonic microelectromechanical system (MEMS) devices. A photonic package may include a material layer patterned to include recesses. The recesses are aligned with the photonic MEMS devices so as to form enclosed cavities around the photonic MEMS devices. This arrangement preserves the integrity of the photonic MEMS devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.