Transistor outline package with glass feedthrough
US11256048B2 · kind B2 · utility
2Cited by
5References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 27, 2019 |
| Grant date | Feb 22, 2022 |
| Priority date | — |
| Expiry date | Aug 29, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/02476
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A transistor outline package is provided that includes a header with a mounting area for an optoelectronic component. The header has a signal pin disposed in a feedthrough. The feedthrough is filled with an insulating material made of glass and/or glass ceramic. The feedthrough has a recessed area on at least one side that is not completely filled up with the insulating material. The recessed area defines a cavity at least partially around the signal pin and the signal pin has an enlarged portion in the recessed area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.