Assembly and method for sealing a bundle of wires
US11257612B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 26, 2018 |
| Grant date | Feb 22, 2022 |
| Priority date | — |
| Expiry date | May 21, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02G15/013
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method for sealing a bundle of wires includes providing an adhesive material having a viscosity of less than about 300 Pa·s at the installation temperature. The method further includes forming a structure from the adhesive and inserting a plurality of wires into the structure. A first amount of heat is applied to the structure in a first heating operation. The first amount of heat being higher than an ambient temperature and lower than a softening temperature of the structure. Subsequently, a second amount of heat is applied in a second heating operation to the adhesive structure to thereby fully melt the adhesive structure and cause the adhesive of the structure to fill voids between the plurality of wires to thereby seal the wires. Application of the first amount of heat during the first operation to the structure facilitates improved melt uniformity of the structure during the second heating operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.